Think – What is the ultimate approach to achieve precision?
Well, it’s paramount to know if what you’ve made is what you designed in the first place. Using in-house, high resolution CT scanning we are able to detect deviations in the molded or assemble part and the created three-dimensional point cloud data over the nominal perfect model. The resulting dimensional solid model is then depicted visually as a color deviation plot, showing variations in all axis down to 0.1 micron resolution (4 millionths of an inch)

The CT scanner creates a mathematical Point Cloud Modeling process revealing a visible explorable 3D representation of exactly the resulting part.  This part is then compared visually to the nominal solid model and is visually depicted in a color deviation plot showing just how precise we managed to recreate customer design intent.  All this seems a bit extreme but it’s really the only way to ensure repeatability and reproducibility of  finished micro molded components and assemblies.

One of the most challenging aspects of micro molding is metrology and Gage R&R.  It is common in micro molding to have more error in the measurement than in the actual parts, however it is critical to obtain expedient and accurate metrology and visual data back to the molding process.  CT scanning provides a full CAD model of the part in less than 10 minutes- the visual CAD being far more useful to a process engineer than several numbers on a page.

In addition to precise measurement techniques, CT provides critical assembly bonding layer data that cannot be obtained by slicing a part open, which damages or destroys the sample.  Bonding layer defects such as bubbles, voids, and improper bonding material distribution over the micro surface.  The 3d images exported are MRI-like and depict an internal wall thickness view of the parts or assemblies that could not otherwise be obtained during validation or production.

CT Scanning Benefits

  • “MRI”-like view of the inside walls of parts and assemblies
  • Non-contact, non-fixturing metrology (eliminates datum errors)
  • Ease of challenging multi-axis positional datum structure
  • Assembly stack-up tolerance fits
  • Bonding layer visualization (Bubbles, voids)
  • Competitive device comparative analysis